AMD XCVC1702-1LSENSVG1369

XCVC1702-1LSENSVG1369

Manufacturer: AMD
AIBOSI NO: XCVC1702-1LSENSVG1369
Package: 1369-BFBGA
Datasheet:
Stock: 52600000
Description: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
Price: $19.00

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Unit Price: $19.0000

Ext Price: $19.0000

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SPECIFICATIONS

Parameters
Mfr	AMD
Series	Versal™ AI Core
Package	Tray
Product Status	Active
Architecture	MPU, FPGA
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size	-
RAM Size	-
Peripherals	DDR, DMA, PCIe
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	400MHz, 1GHz
Primary Attributes	Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package / Case	1369-BFBGA
Supplier Device Package	1369-BGA (35x35)
Number of I/O	500
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
ECCN	3A001A7B
HTSUS	8542.39.0001
Other Names	122-XCVC1702-1LSENSVG1369
Standard Package	1

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)