Microsemi Corporation A2F060M3E-1FGG256M

A2F060M3E-1FGG256M

Manufacturer: Microsemi Corporation
AIBOSI NO: A2F060M3E-1FGG256M
Package: 256-LBGA
Datasheet:
Stock: 85600000
Description: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)
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SPECIFICATIONS

Parameters
Mfr	Microsemi Corporation
Series	SmartFusion®
Package	Tray
Product Status	Obsolete
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	128KB
RAM Size	16KB
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I²C, SPI, UART/USART
Speed	100MHz
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature	-55°C ~ 125°C (TJ)
Package / Case	256-LBGA
Supplier Device Package	256-FPBGA (17x17)
Number of I/O	MCU - 26, FPGA - 66
Base Product Number	A2F060M3E
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2C
HTSUS	8542.39.0001
Standard Package	90