Microchip Technology M2S060-1FGG676I

M2S060-1FGG676I

Manufacturer: Microchip Technology
AIBOSI NO: M2S060-1FGG676I
Package: 676-BGA
Datasheet:
Stock: 32460000
Description: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 166MHz 676-FBGA (27x27)
Price: $96.53

Qty
Unit Price
Ext Price

40

$193.07

$7,722.75

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Quantity:

Add to Cart

Unit Price: $96.5344

Ext Price: $96.5344

In Stock

Please send RFQ , we will respond immediately.

Company Name

Contact Name

Business Email

Quantity

Purchase & Inquiry

Transport

Packing

Shipping

Payment

Purchase

You may place an order without registering to AIBOSI.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr	Microchip Technology
Series	SmartFusion®2
Package	Tray
Product Status	Active
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	256KB
RAM Size	64KB
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz
Primary Attributes	FPGA - 60K Logic Modules
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	676-BGA
Supplier Device Package	676-FBGA (27x27)
Number of I/O	387
Base Product Number	M2S060
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001
Standard Package	40