Infineon Technologies CYV15G0402DXB-BGC

CYV15G0402DXB-BGC

Manufacturer: Infineon Technologies
AIBOSI NO: CYV15G0402DXB-BGC
Package: 256-BGA Exposed Pad
Datasheet:
Stock: 62030000
Description: Telecom IC 256-L2BGA (27x27)
Price:

Quantity:

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr	Infineon Technologies
Series	HOTlink II™
Package	Tray
Product Status	Obsolete
Function	-
Interface	LVTTL
Number of Circuits	4
Voltage - Supply	3.135V ~ 3.465V
Current - Supply	830mA
Operating Temperature	0°C ~ 70°C
Mounting Type	Surface Mount
Package / Case	256-BGA Exposed Pad
Supplier Device Package	256-L2BGA (27x27)
Base Product Number	CYV15G0402
RoHS Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	5 (48 Hours)
REACH Status	REACH Unaffected
ECCN	5A991B1
HTSUS	8542.39.0001
Standard Package	40