AMD XCZU19EG-3FFVD1760E

XCZU19EG-3FFVD1760E

Manufacturer: AMD
AIBOSI NO: XCZU19EG-3FFVD1760E
Package: 1760-BBGA, FCBGA
Datasheet:
Stock: 58880000
Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 600
Price: $13.00

Quantity:

Add to Cart

Unit Price: $13.0000

Ext Price: $13.0000

In Stock

Please send RFQ , we will respond immediately.

Company Name

Contact Name

Business Email

Quantity

Purchase & Inquiry

Transport

Packing

Shipping

Payment

Purchase

You may place an order without registering to AIBOSI.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr	AMD
Series	Zynq® UltraScale+™ MPSoC EG
Package	Tray
Product Status	Active
Architecture	MCU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size	-
RAM Size	256KB
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	600MHz, 667MHz, 1.5GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package / Case	1760-BBGA, FCBGA
Supplier Device Package	1760-FCBGA (42.5x42.5)
Number of I/O	308
Base Product Number	XCZU19
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	5A002A4 XIL
HTSUS	8542.39.0001
Standard Package	1

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5)